18.119.139.59
18.119.139.59
close menu
MIL - HDBK - 217 을 이용한 전자부품의 고장률 추정과 가속수명시험에 관한 연구
A Study on the Reliability Prediction using MIL - HDBK - 217 and the Accelerated Life Testing of Electronic Component
소동수(Dong Soo So),강희정(Hee Jung Kang)
UCI I410-ECN-0102-2009-550-006560802

The objective of this study is to predict the reliability and to design the Accelerated Life Testing(ALT) of the electronic component. The MIL-HDBK-217 is adapted to predict the theoretical reliability. Modern electronic components have high reliability s

[자료제공 : 네이버학술정보]
×