Failure analysis is a process of determining causes of failures, collecting and analyzing data, and drawing conclusions to eliminate failure mechanisms. A failure investigation and subsequent analysis determine the primary cause of a failure, and corrective action based on the determination will prevent similar failures. This paper presents a general procedure, techniques, and precautions employed in the investigation and analysis of electronic components failures. The various features of failure analysis are discussed according to its stages and a case study for the failure of ceramic capacitor applied in a RAM card is also investigated.