The purpose of this study is to find out optimum electroplating thickness of Ni and SnPb on electronic component to be warranted the solderability during one year storage. The thickness of electroplating on electronic component has strong relationship with the failure rate of component. This is one of the key factors to make a system to degrade. Because the poor electroplating results in de-wetting or non-wetting status during soldering process. we choose the copper(φ=0.8mm) wire for sample, and then Ni and SnPb electrodeposited on it with different thickness each other. The specimens were tested under the steam ageing tester and dry oven to investigate accelerated ageing factor. In case of steam ageing test, the test times are 4, 20 hours and in the case of dry heat test, 4, 16 hours. Also we measured the intermetallic compounds thickness of Cu/Ni/SnPb using by SEM(Scanning Electron Microscope). From these analyses, we suggest to optimize plating thickness to insure the solderability during one year storage.