The heat transfer characteristics of a plasma display panel has been investigated for cooling an electronic module. Hence, a two dimensional turbulent model was developed to predict the temperatures of the panel and module. The heat conduction was solved for the material region. To consider the mixed convection at the solid-fluid interfaces between the air and the panel and module, the energy equation was solved simultaneously. When the electronic module stands face to face with the panel, the temperatures of panel and module are lower than other arrangement due to the chimney effect. However, the gap between the panel and module does not affect significantly the maximum temperature when the aspect ratio is less than 0.1. To maintain the maximum temperature of the module under a certain limit, the passage of air should be well designed by the optimal layout of electronic modules which have different heat emission.